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Dissolution of Primary Carbides and Formation and Healing of Kirkendall Voids in Bearing Steel under Pulsed Electric Current 期刊论文
STEEL RESEARCH INTERNATIONAL, 2024, 页码: 16
作者:  Wang, Zhongxue;  Zhang, Tao;  Zhou, Mengcheng;  Zhang, Mingkui;  Ma, Jinchao;  Zhang, Xinfang;  Guo, Jingdong;  Liu, Jide;  Zhou, Yizhou
收藏  |  浏览/下载：3/0  |  提交时间：2025/04/27
dissolution  formation and healing  Kirkendall voids  primary carbides  pulsed electric currents  
Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
收藏  |  浏览/下载：9/0  |  提交时间：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Heterogeneous microstructure and voids dependence of tensile deformation in a selective laser melted AlSi10Mg alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 798, 页码: 11
作者:  Ben, D. D.;  Ma, Y. R.;  Yang, H. J.;  Meng, L. X.;  Shao, X. H.;  Liu, H. Q.;  Wang, S. G.;  Duan, Q. Q.;  Zhang, Z. F.
收藏  |  浏览/下载：224/0  |  提交时间：2021/02/02
AlSi10Mg alloy  Selective laser melting  Heterogeneous microstructures  Strain localization  Voids  
Heterogeneous microstructure and voids dependence of tensile deformation in a selective laser melted AlSi10Mg alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 798, 页码: 11
作者:  Ben, D. D.;  Ma, Y. R.;  Yang, H. J.;  Meng, L. X.;  Shao, X. H.;  Liu, H. Q.;  Wang, S. G.;  Duan, Q. Q.;  Zhang, Z. F.
收藏  |  浏览/下载：224/0  |  提交时间：2021/02/02
AlSi10Mg alloy  Selective laser melting  Heterogeneous microstructures  Strain localization  Voids  
Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 792, 页码: 10
作者:  Yang, Yu-Jia;  Zhang, Bin;  Wan, Hong-Yuan;  Zhang, Guang-Ping
收藏  |  浏览/下载：120/0  |  提交时间：2021/02/02
Cu  Graphene  Interface  Fatigue extrusions  Voids  
Interface facilitated transformation of voids directly into stacking fault tetrahedra 期刊论文
ACTA MATERIALIA, 2020, 卷号: 188, 页码: 623-634
作者:  Kong, X. F.;  Gao, N.;  Beyerlein, I. J.;  Yao, B. N.;  Zheng, S. J.;  Ma, X. L.;  Legut, D.;  Germann, T. C.;  Zhang, H. J.;  Zhang, R. F.
收藏  |  浏览/下载：160/0  |  提交时间：2021/02/02
Voids  Stacking fault tetrahedron  Interface  Transformation  Dislocation  Damage  
Interface facilitated transformation of voids directly into stacking fault tetrahedra 期刊论文
ACTA MATERIALIA, 2020, 卷号: 188, 页码: 623-634
作者:  Kong, X. F.;  Gao, N.;  Beyerlein, I. J.;  Yao, B. N.;  Zheng, S. J.;  Ma, X. L.;  Legut, D.;  Germann, T. C.;  Zhang, H. J.;  Zhang, R. F.
收藏  |  浏览/下载：161/0  |  提交时间：2021/02/02
Voids  Stacking fault tetrahedron  Interface  Transformation  Dislocation  Damage  
The premature necking of twinning-induced plasticity steels 期刊论文
PERGAMON-ELSEVIER SCIENCE LTD, 2017, 卷号: 136, 页码: 1-10
作者:  Yang, C. L.;  Zhang, Z. J.;  Zhang, P.;  Zhang, Z. F.;  Zhang, ZJ;  Zhang, ZF (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：100/0  |  提交时间：2018/01/10
Twinning-induced Plasticity Steel  Voids  Necking  Strain-hardening Rate  
New preparation method of micron porous copper through physical vacuum dealloying of Cu-Zn alloys 期刊论文
MATERIALS LETTERS, 2016, 卷号: 165, 页码: 1-4
作者:  Sun, Yuxia;  Ren, Yibin;  Yang, Ke
收藏  |  浏览/下载：124/0  |  提交时间：2016/04/21
Porous Materials  Dealloying  Diffusion  Kirkendall Voids  Sublimation  Cu-zn Alloy  
Pentavacancy as the key nucleus for vacancy clustering in aluminum 期刊论文
Physical Review B, 2011, 卷号: 84, 期号: 22
作者:  H. Wang;  D. Rodney;  D. S. Xu;  R. Yang;  P. Veyssiere
Adobe PDF(664Kb)  |  收藏  |  浏览/下载：122/0  |  提交时间：2012/04/13
Quenched Aluminum  Fcc Metals  Electrical Resistivity  Dislocation  Dipoles  Transformation  Annihilation  Simulation  Kinetics  Voids