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The effect of laser post-treatment on the microstructure and properties of Al coating on the PEEK substrate 期刊论文
OPTICS AND LASER TECHNOLOGY, 2024, 卷号: 179, 页码: 10
作者:  Wang, Kang;  Liu, Hanhui;  Zhao, Feng;  Cui, Xinyu;  Wang, Jiqiang;  Xiong, Tianying
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Polyetheretherketone  Surface metallization  Cold spray  Laser post-treatment  
Influence of Al2O3 content on microstructure, electrical conductivity and adhesion strength of cold sprayed Al-Al2O3 coatings on PEEK substrate 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 446, 页码: 13
作者:  Liu, Hanhui;  Tariq, Naeem ul Haq;  Ren, Yupeng;  Zhao, Lijia;  Yang, Ying;  Cui, Xinyu;  Wang, Jiqiang;  Xiong, Tianying
收藏  |  浏览/下载：146/0  |  提交时间：2022/09/16
Cold spray  PEEK  Al-Al2O3 coating  Surface metallization  Electrical conductivity  Adhesion strength  
Effect of accelerating gas temperature on microstructure and properties of cold sprayed Al coating on polyether ether ketone (PEEK) 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 429, 页码: 11
作者:  Liu, Hanhui;  Tariq, Naeem ul Haq;  Ren, Yupeng;  Luo, Jing;  Liu, Housheng;  Zhao, LiJia;  Cui, Xinyu;  Wang, Jiqiang;  Xiong, Tianying
收藏  |  浏览/下载：125/0  |  提交时间：2022/01/27
Cold spray  PEEK  Accelerating gas temperature  Coating properties  Surface metallization  Deposition behavior  
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
作者:  H. F. Zhou;  J. D. Guo;  Q. S. Zhu;  J. K. Shang
收藏  |  浏览/下载：143/0  |  提交时间：2013/12/24
Under-bump Metallization (Ubm)  Electroless Fe-42ni(p)  Sn  Solderability  Interfacial Reaction  Fe-p  Solderability  Deposition  Alloys  Sn  Behavior  Systems  Surface  Cu  
Characterization of Ag adsorption on TiC(001) substrate: an ab initio study 期刊论文
Chinese Physics B, 2008, 卷号: 17, 期号: 10, 页码: 3856-3866
作者:  S. Y. Ma;  S. Q. Wang
Adobe PDF(1300Kb)  |  收藏  |  浏览/下载：81/0  |  提交时间：2012/04/13
Surface Adsorption  Ag/tic Interface  Dft Calculation  Electronic  Structure  Titanium Carbide  Ag/mgo(001) Interface  Diffusion Barrier  Liquid-metals  Growth Mode  Surface  Adhesion  Metallization  Films  Deposition