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Study on the grindability and removal mechanism of high volume fraction SiCp/Al composites based on single diamond grain grinding 期刊论文
ARCHIVES OF CIVIL AND MECHANICAL ENGINEERING, 2024, 卷号: 24, 期号: 4, 页码: 19
作者:  Yin, Guoqiang;  Liang, Hongrui;  Wang, Dong;  Liu, Zeyu;  Zhou, Yunguang
收藏  |  浏览/下载：4/0  |  提交时间：2025/04/27
SiCp/Al composites  3D simulation  Single diamond grain  Removal mechanism  Surface/Subsurface damage  
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR;  Suganuma, K;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.;  Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：145/0  |  提交时间：2018/06/05
Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth