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Enhancement of in-plane thermal conductivity of flexible boron nitride heat spreaders by micro/nanovoid filling using deformable liquid metal nanoparticles 期刊论文
RARE METALS, 2023, 页码: 11
作者:  Tao, Pei-Di;  Wang, Shao-Gang;  Chen, Lu;  Ying, Jun-Feng;  Lv, Le;  Sun, Li-Wen;  Chu, Wu-Bo;  Nishimura, Kazuhito;  Fu, Li;  Wang, Yue-Zhong;  Yu, Jin-Hong;  Jiang, Nan;  Dai, Wen;  Lv, Yao-Kang;  Lin, Cheng-Te;  Yan, Qing-Wei
收藏  |  浏览/下载：10/0  |  提交时间：2024/01/08
Boron nitride nanosheet  Liquid metal  Eutectic gallium-indium  In-plane thermal conductivity  Heat spreader  
Bioinspired Fabrication of Calcium-Doped TiP Coating with Nanofibrous Microstructure to Accelerate Osseointegration 期刊论文
BIOCONJUGATE CHEMISTRY, 2020, 卷号: 31, 期号: 6, 页码: 1641-1650
作者:  Cai, Bianyun;  Tan, Peijie;  Jiang, Nan;  Guo, Zhijun;  Ay, Birol;  Li, Shujun;  Hou, Yi;  Li, Yubao;  You, Yanjun;  Zhang, Li;  Zhu, Songsong
收藏  |  浏览/下载：119/0  |  提交时间：2021/02/02
Bioinspired Fabrication of Calcium-Doped TiP Coating with Nanofibrous Microstructure to Accelerate Osseointegration 期刊论文
BIOCONJUGATE CHEMISTRY, 2020, 卷号: 31, 期号: 6, 页码: 1641-1650
作者:  Cai, Bianyun;  Tan, Peijie;  Jiang, Nan;  Guo, Zhijun;  Ay, Birol;  Li, Shujun;  Hou, Yi;  Li, Yubao;  You, Yanjun;  Zhang, Li;  Zhu, Songsong
收藏  |  浏览/下载：144/0  |  提交时间：2021/02/02
Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
收藏  |  浏览/下载：198/0  |  提交时间：2021/02/02
Lead-free solder  reliability  IMC  crack  failure  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
收藏  |  浏览/下载：135/0  |  提交时间：2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
收藏  |  浏览/下载：157/0  |  提交时间：2021/02/02
FCBGA器件SnAgCu焊点的热冲击可靠性分析 期刊论文
焊接学报, 2019, 卷号: 40, 期号: 09, 页码: 39-42+162
作者:  姜楠;  张亮;  刘志权;  熊明月;  龙伟民
收藏  |  浏览/下载：142/0  |  提交时间：2021/02/02
有限元法  热冲击  焊点  可靠性  疲劳寿命  
Modified surface morphology of a novel Ti-24Nb-4Zr-7.9Sn titanium alloy via anodic oxidation for enhanced interfacial biocompatibility and osseointegration 期刊论文
COLLOIDS AND SURFACES B-BIOINTERFACES, 2016, 卷号: 144, 页码: 265-275
作者:  Li, Xiang;  Chen, Tao;  Hu, Jing;  Li, Shujun;  Zou, Qin;  Li, Yunfeng;  Jiang, Nan;  Li, Hui;  Li, Jihua;  Li, JH (reprint author), Sichuan Univ, West China Coll Stomatol, Chengdu 610041, Sichuan, Peoples R China.
收藏  |  浏览/下载：152/0  |  提交时间：2016/08/22
Ti-24nb-4zr-7.9sn  Anodic Oxidation  Hierarchical Structure  Biocompatibility  Osteointegration  
Design, synthesis and antiproliferative activity of novel 2,7-disubstituted triazolo1,5-apyrimidines 期刊论文
CHINESE CHEMICAL LETTERS, 2009, 卷号: 20, 期号: 10, 页码: 1179-1182
作者:  Zhai Xin;  Jiang Nan;  Zhang Ke Liang;  Bao Feng;  Gong Ping
收藏  |  浏览/下载：82/0  |  提交时间：2021/02/02
SAR  Triazolo1,5-apyrimidines  Synthesis  Antiproliferative activity