Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics

doi:10.1088/1361-6528/ab5fed

IMR OpenIR

	Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics
	Wang,Xin 1; Huang,Feirong 1; Wang,Dongxing 2; Li,Da 3; Li,Pu 4; Muhammad,Javid 1; Dong,Xinglong 1; Zhang,Zhidong 3
	2020-01-14
发表期刊	Nanotechnology
ISSN	0957-4484
卷号	31 期号:13
摘要	Abstract In this work, Ag–Cu and Ag–Sn nanoparticles (NPs) were synthesized by a physical vapor condensation method, i.e. DC arc-discharge plasma. The as-prepared bimetallic NPs consist of metallic cores of Ag–Cu or Ag–Sn and ultrathin oxide shells of CuO or a hybrid of SnO and SnO2. Ag–Sn NPs exhibit a room-temperature resistivity of 4.24?×?10?5 Ω?·?cm, a little lower than 7.10?×?10?5 Ω?·?cm of Ag–Cu NPs. Both bimetallic NPs demonstrate typical metallic conduction behavior with a positive temperature coefficient of resistance over 25–300 K. Ag–Sn NPs exhibit thermally competitive stability up to 230 °C and a lower resistivity of 3.18?×?10?5 Ω?·?cm after sintering at 200 °C, giving it potential for application in flexible printed electronics.
关键词	DC arc-discharge method bimetallic nanoparticles printed electronics thermal stability resistivity
DOI	10.1088/1361-6528/ab5fed
语种	英语
WOS记录号	IOP:0957-4484-31-13-ab5fed
出版者	IOP Publishing
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/80612
专题	中国科学院金属研究所
作者单位	1.School of Materials Science and Engineering, Key Laboratory of Materials Modification by Laser, Ion and Electron Beams (Ministry of Education), Dalian University of Technology, Dalian 116023, People’s Republic of China 2.Institute of Materials, Ningbo University of Technology, Ningbo, 315016, People’s Republic of China 3.Shenyang National Laboratory for Materials Science, Institute of Metal Research, International Centre for Materials Physics, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China 4.China United Test & Certification Co., LTD, General Research Institute for Nonferrous Metals, Beijing, 100088, People’s Republic of China
推荐引用方式 GB/T 7714	Wang,Xin,Huang,Feirong,Wang,Dongxing,等. Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics[J]. Nanotechnology,2020,31(13).
APA	Wang,Xin.,Huang,Feirong.,Wang,Dongxing.,Li,Da.,Li,Pu.,...&Zhang,Zhidong.(2020).Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics.Nanotechnology,31(13).
MLA	Wang,Xin,et al."Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics".Nanotechnology 31.13(2020).