| Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling |
| L. M.; Zhang Yang, Z. F.
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| 2015
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| 发表期刊 | Journal of Electronic Materials
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| ISSN | 0361-5235
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| 卷号 | 44期号:1页码:590-596 |
| 摘要 | The growth behavior of intermetallic compounds (IMC) in Cu/Sn3.0Ag0.5Cu solder joints, including the interfacial Cu6Sn5 layer and Ag3Sn, and Cu6Sn5 in the solder, were investigated when different cooling methods-quenched water, cooling in air, and cooling in a furnace after reflow-were used. For the solder joint quenched in water, no obvious Cu6Sn5 or Ag3Sn was detected in the solder, and the thickness of interfacial Cu6Sn5 layer was slightly thinner than that of the joint cooled in air. On the basis of results from scanning electron microscopy and energy-dispersive spectrometry, a mechanism is proposed for growth of IMC in Sn3.0Ag0.5Cu solder during solidification. The rate of cooling has a substantial effect on the morphology and size of Ag3Sn, which evolved into large plate-like shapes when the joint was cooled slowly in a furnace. However, the morphology of Ag3Sn was branch-like or particle-like when the joint was cooled in air. This is attributed to re-growth of Ag3Sn grains via substantial atomic diffusion during the high-temperature stage of furnace cooling. |
| 部门归属 | [yang, linmei
; zhang, z. f.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang 110016, peoples r china. [yang, linmei] shenyang univ technol, shenyang 110870, peoples r china.
; yang, lm (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, 72 wenhua rd, shenyang 110016, peoples r china.
; linmeiyang@126.com
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| 关键词 | Intermetallic Compounds (Imc)
Solder Joint
Cooling Rate
Solidification
Adsorption
Ag-cu Solder
Cu6sn5 Grains
In-situ
Sn
Alloy
Nanoparticles
Ag3sn
Microstructure
Technology
Particles
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| URL | 查看原文
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| 文献类型 | 期刊论文
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| 条目标识符 | http://ir.imr.ac.cn/handle/321006/74002
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| 专题 | 中国科学院金属研究所
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推荐引用方式
GB/T 7714 |
L. M.,Zhang Yang, Z. F.. Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling[J]. Journal of Electronic Materials,2015,44(1):590-596.
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| APA |
L. M.,&Zhang Yang, Z. F..(2015).Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling.Journal of Electronic Materials,44(1),590-596.
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| MLA |
L. M.,et al."Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling".Journal of Electronic Materials 44.1(2015):590-596.
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