Evolution and change of He bubbles in He-containing Ti films upon thermal treatment studied by small-angle X-ray scattering and transmission electron microscopy

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	Evolution and change of He bubbles in He-containing Ti films upon thermal treatment studied by small-angle X-ray scattering and transmission electron microscopy
	G. A. Sun; E. D. Wu; C. Q. Huang; C. Cheng; G. Y. Yan; X. L. Wang; S. Liu; Q. Tian; B. Chen; Z. H. Wu; Y. Liu; J. Wang
	2014
发表期刊	Thin Solid Films
ISSN	0040-6090
卷号	558 页码:125-133
摘要	Evolution and change of He bubbles in magnetron sputtering prepared He-containing Ti films under thermal treatment are studied by small-angle X-ray scattering (SAXS), transmission electron microscopy (TEM) and X-ray diffraction. Incorporation of He introduces a large number of He-vacancy clusters and some voids in the films, and significantly increases SAXS intensity and causes anisotropic scattering. The change of He induced defects during annealing is affected by thermal diffusion and migration of trapped He to the surface and between interfaces of He induced defects within the films. Annealing at 200 and 400 degrees C reduces intensity and anisotropy of SAXS, in accord with observed shrinking and disappearance of the voids. The simultaneous growth of non-uniformly distributed He bubbles to the sizes of 1-2 nm and a population level of 10(5)/mu m(3) are detected in the temperature range. The changes are explained by migration and coalescence mechanisms, which requires low apparent activation energy. Inconsistence between TEM and SAXS observations is noted and attributed to thinning induced internal stress relaxation of TEM specimen. Remarkable enlargement of He bubbles, associated with increased SAXS intensity and fractal dimension, is observed after 600 degrees C annealing, indicating involvement of Ostwald Ripening (OR) mechanism. The OR process dominates at 800 degrees C, where the high temperature provides activation energy for accelerated He dissociation from small bubbles into larger ones, and generating textured microstructure and agglomerated bubble clusters. The inhomogeneous bubble size distribution observed at this temperature covers a broad range of about 10-50 nm and possessing a population density level of 10(3)/mu m(3). (C) 2014 Elsevier B.V. All rights reserved.
部门归属	[sun, guangai ; huang, chaoqiang ; yan, guanyun ; wang, xiaolin ; tian, qiang ; chen, bo] china acad engn phys, inst nucl phys & chem, mianyang 621900, peoples r china. [wu, erdong ; cheng, chun ; liu, shi] chinese acad sci, inst met res, natl lab mat sci, shenyang 110016, peoples r china. [sun, guangai ; huang, chaoqiang ; wang, xiaolin] univ sci & technol china, coll nucl sci & technol, hefei 230029, peoples r china. [wu, zhonghua] chinese acad sci, inst high energy phys, beijing 100049, peoples r china. [liu, yi ; wang, jie] chinese acad sci, inst shanghai apply phys, shanghai 201800, peoples r china. ; wu, ed (reprint author), chinese acad sci, inst met res, natl lab mat sci, shenyang 110016, peoples r china. ; ewu@imr.ac.cn
关键词	Helium Bubbles Bubble Evolution Small-angle X-ray Scattering Transmission Electron Microscopy Thermal Treatment Magnetron Sputtering Titanium-helium Films Helium Bubbles Metal Tritides Neutron-scattering Titanium Tritides Gas Behavior Release Nickel Tem Coalescence
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/72910
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	G. A. Sun,E. D. Wu,C. Q. Huang,et al. Evolution and change of He bubbles in He-containing Ti films upon thermal treatment studied by small-angle X-ray scattering and transmission electron microscopy[J]. Thin Solid Films,2014,558:125-133.
APA	G. A. Sun.,E. D. Wu.,C. Q. Huang.,C. Cheng.,G. Y. Yan.,...&J. Wang.(2014).Evolution and change of He bubbles in He-containing Ti films upon thermal treatment studied by small-angle X-ray scattering and transmission electron microscopy.Thin Solid Films,558,125-133.
MLA	G. A. Sun,et al."Evolution and change of He bubbles in He-containing Ti films upon thermal treatment studied by small-angle X-ray scattering and transmission electron microscopy".Thin Solid Films 558(2014):125-133.