Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process

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	Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process
	P. J. Shang; L. Zhang; Z. Q. Liu; J. Tan; J. K. Shang
	2013
发表期刊	Microelectronics Reliability
ISSN	0026-2714
卷号	53 期号:6 页码:899-905
摘要	We focused on the surface microstructure and morphology changes of Cu/eutectic SnBi/Cu joint during solid-state aging process through ex situ scanning electron microscopy (SEM) observations and energy dispersive X-ray spectroscopy (EDXS) analysis. Different intermetallic compound (IMC) growth behaviors on the surface from the bulk of solder joints were observed and investigated. The results indicated that at the initial stage of solid-state aging IMCs protruded from the interfacial region with two different microstructures, the small particles on the Cu surface and chunk-type IMC at the solder side. With the increment of solid-state aging time, although the total thickness of IMCs increased very slowly, Cu3Sn phases grew fast by the consumption of Cu6Sn5 phase. Growth kinetic analyses for IMC on the surface and in the bulk of solder joints revealed that the IMC growth on the surface was faster than that in the bulk at the initial stage. For the long-term aging, although the total IMC thickness was still thicker than that in the bulk, the rate of the IMC growth on the surface was slower than that in the bulk. The growth of IMC on the surface of interfacial region was divided into two distinct stages, which corresponds to different IMC growth behaviors. (C) 2013 Elsevier Ltd. All rights reserved.
部门归属	[shang, p. j. ; zhang, l. ; liu, z. q. ; tan, j. ; shang, j. k.] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, p. j.] chinese univ hong kong, dept phys, shatin, hong kong, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa. ; shang, pj (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. ; pjshang@imr.ac.cn ; lzhang@imr.ac.cn
关键词	Mechanical-properties Joints Copper Morphology Tin
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/71445
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	P. J. Shang,L. Zhang,Z. Q. Liu,et al. Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process[J]. Microelectronics Reliability,2013,53(6):899-905.
APA	P. J. Shang,L. Zhang,Z. Q. Liu,J. Tan,&J. K. Shang.(2013).Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process.Microelectronics Reliability,53(6),899-905.
MLA	P. J. Shang,et al."Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process".Microelectronics Reliability 53.6(2013):899-905.