The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

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	The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy
	C. F. Li; Z. Q. Liu; J. K. Shang
	2013
发表期刊	Journal of Alloys and Compounds
ISSN	0925-8388
卷号	550 页码:231-238
摘要	The effects of exposure time, temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy were investigated via scanning electron microscopy. It was found that tin whiskers grew from NdSn3 compound, while hillocks grew from the tin matrix around the NdSn3 compound, which was induced by the oxidation of NdSn3 compound by oxygen and water vapor in the ambient. More tin whiskers and/or hillocks were extruded from the substrate with longer exposure time, higher temperature and higher humidity. This resulted in the formation of various morphologies of tin extrusions at different storage conditions, including thread-like, spiral, flute-like, claw-like, sprout-like, chrysanthemum-like and rod-like whiskers, as well as hillocks. Tin whisker was extruded from the crack of the surface Nd(OH)(3) layer which serves as the mold of tin whisker growth. And the proposed growth models of tin whisker and hillock on Sn-Nd alloy can explain the diversity of the whisker morphology. (C) 2012 Elsevier B.V. All rights reserved.
部门归属	[li, cai-fu ; liu, zhi-quan ; shang, jian-ku] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. ; liu, zq (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. ; zqliu@imr.ac.cn
关键词	Tin Whisker Hillock Ndsn3 Oxidation Growth Mechanism Lead-free Solder Electron-microscopy Nd Addition Sn-whiskers Joints Mechanisms
URL	查看原文
语种	英语
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/71308
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	C. F. Li,Z. Q. Liu,J. K. Shang. The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy[J]. Journal of Alloys and Compounds,2013,550:231-238.
APA	C. F. Li,Z. Q. Liu,&J. K. Shang.(2013).The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy.Journal of Alloys and Compounds,550,231-238.
MLA	C. F. Li,et al."The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy".Journal of Alloys and Compounds 550(2013):231-238.