Current-induced growth of P-rich phase at electroless nickel/Sn interface

IMR OpenIR

	Current-induced growth of P-rich phase at electroless nickel/Sn interface
	Q. L. Yang; P. J. Shang; J. D. Guo; Z. Q. Liu; J. K. Shang
	2009
发表期刊	Journal of Materials Research
ISSN	0884-2914
卷号	24 期号:9 页码:2767-2774
摘要	The role of high current stressing during growth of the P-rich phase at the electroless Ni/Sn interface was examined by transmission electron microscopy. Prior to current stressing, two layers of Ni(12)P(5), columnar Ni(12)P(5) and noncolumnar Ni(12)P(5), were formed after soldering. Upon electric stressing, the two layers of P-rich phase showed opposite growth patterns at the two opposing electrode interfaces. At the cathode, columnar growth of the P-rich phase was greatly enhanced while growth of the noncolumnar layer was inhibited. By contrast, the opposite was found at the anode where the current stressing promoted the noncolumnar growth but suppressed the growth of the columnar layer. Such a strong polarity effect resulted from directional electromigration of the key reaction species, nickel, to and from the interfacial reaction fronts. As a result of the difference in reaction mechanism, overall growth of the P-rich phase was much faster at the cathode during current stressing.
部门归属	[yang, qiliang; shang, panju; guo, jing d.; liu, zhiquan; shang, jian-ku] chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china. [shang, jian-ku] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;shang, jk (reprint author), chinese acad sci, shenyang natl lab mat sci, inst met res, shenyang 110016, peoples r china;jkshang@uiuc.edu
关键词	Intermetallic Compound Formation Under-bump Metallization Sn-ag Solder Ni-p Sn-3.5ag Solder Shear-strength Metallurgical Reaction Mechanical Strength Phosphorus-content Thermal-stability
URL	查看原文
WOS记录号	WOS:000269585300004
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/32492
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. L. Yang,P. J. Shang,J. D. Guo,et al. Current-induced growth of P-rich phase at electroless nickel/Sn interface[J]. Journal of Materials Research,2009,24(9):2767-2774.
APA	Q. L. Yang,P. J. Shang,J. D. Guo,Z. Q. Liu,&J. K. Shang.(2009).Current-induced growth of P-rich phase at electroless nickel/Sn interface.Journal of Materials Research,24(9),2767-2774.
MLA	Q. L. Yang,et al."Current-induced growth of P-rich phase at electroless nickel/Sn interface".Journal of Materials Research 24.9(2009):2767-2774.