Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings

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	Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings
	J. P. Daghfal; P. J. Shang; Z. Q. Liu; J. K. Shang
	2009
发表期刊	Journal of Electronic Materials
ISSN	0361-5235
卷号	38 期号:12 页码:2506-2515
摘要	Interfacial interactions in a Ni-xFe-Sn-In eutectic solder (x = 30 at.%, 55 at.%) have been examined. Transmission and scanning electron microscopy (TEM/SEM) were utilized to investigate the structure, composition, and morphology of the intermetallic compounds (IMCs). Upon reflow, Ni(3)Sn(4) and FeSn(2) phases appeared at the interface along with Cu(6)Sn(5) in the solder. Annealing experiments revealed the formation of a bilayer IMC that was Fe-rich adjacent to the Ni-Fe metallization and Ni-rich on the solder side. Kinetic studies established the apparent activation energies for both systems to be 51.8 kJ/mol and 85.1 kJ/mol, for 30 at.% and 55 at.% Fe contents, respectively. In the Fe-rich system, globular Ni(3)Sn(4) crystals were formed upon reflow, but were changed into a cubic/faceted structure after annealing.
部门归属	[daghfal, john p.; shang, p. j.; liu, z. q.; shang, j. k.] chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang, peoples r china. [shang, j. k.] univ illinois, dept mat sci & engn, urbana, il 61801 usa.;daghfal, jp (reprint author), chinese acad sci, inst met res, shenyang natl lab mat sci, shenyang, peoples r china;jkshang@uiuc.edu
关键词	In-sn Solder Ni-fe Metallization Interface Fesn(2) Ni(3)Sn(4) Faceting In-48sn Solder In-49sn Solder Reflow Process Microstructure Substrate Packages Kinetics Alloy Joint Ag
URL	查看原文
WOS记录号	WOS:000272301900012
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/31862
专题	中国科学院金属研究所
推荐引用方式 GB/T 7714	J. P. Daghfal,P. J. Shang,Z. Q. Liu,et al. Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings[J]. Journal of Electronic Materials,2009,38(12):2506-2515.
APA	J. P. Daghfal,P. J. Shang,Z. Q. Liu,&J. K. Shang.(2009).Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings.Journal of Electronic Materials,38(12),2506-2515.
MLA	J. P. Daghfal,et al."Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings".Journal of Electronic Materials 38.12(2009):2506-2515.