Flash soldering of boron nitride nanosheets for all-ceramic films

doi:10.1016/j.cej.2024.152156

IMR OpenIR

	Flash soldering of boron nitride nanosheets for all-ceramic films
	Ding, Siyuan 1; Zhan, Ke 1; Du, Yu 2,3; Zhen, Fangzheng 2,3; Zhu, Jiuyi 4; Ding, Baofu 5,6; Yu, Aibing 2,3; Liu, Minsu 2,3; Cheng, Hui-Ming 1,5,6,7; Qiu, Ling 1
通讯作者	Liu, Minsu(minsu.liu1@monash.edu) ; Cheng, Hui-Ming(hm.cheng@siat.ac.cn) ; Qiu, Ling(ling.qiu@sz.tsinghua.edu.cn)
	2024-07-01
发表期刊	CHEMICAL ENGINEERING JOURNAL
ISSN	1385-8947
卷号	491 页码:11
摘要	The assembly of boron nitride nanosheets (BNNSs) into strong, flexible thin films capable of withstanding extreme conditions, such as high/low working temperatures and corrosive environments, holds promise for numerous applications. However, Assmebling and sintering of BNNS into dense thin film can be challenging. We report the rapid fabrication of dense BNNS all-ceramic films (BACFs) in 30 s by combining the fabrication strategies for 2D and ceramic materials. In this process, densely arranged and highly oriented BNNSs are flash soldered into a monolith achieved by precisely controlled ultrafast sintering. This fusion of BNNS leads to an ultrahigh in-plane thermal conductivity of 134.5 W center dot m(-1)center dot K-1. The as-prepared BACF exhibits the combined advantages of sintered ceramics (durability, stability, acid-alkali resistance) and 2D material films such as flexibility and shock resistance, which is important for practical uses. It also has excellent cooling performance, dielectric properties, and good thermal stability, which is promising for demanding thermal management applications in emerging technologies.
关键词	Boron Nitride 2D materials Flash soldering Ceramic film Thermal management
资助者	National Key Research and Development Project ; National Natural Science Foundation of China ; Guangdong Basic and Applied Basic Research Foundation ; Shenzhen Basic Research Project ; Jiangsu Department of Technology Natural Science Fund ; Dushu Lake Leading Talent Project
DOI	10.1016/j.cej.2024.152156
收录类别	SCI
语种	英语
资助项目	National Key Research and Development Project[2022YFA1205300] ; National Key Research and Development Project[2019YFA0705403] ; National Natural Science Foundation of China[T2293693] ; National Natural Science Foundation of China[5220020670] ; Guangdong Basic and Applied Basic Research Foundation[2020B0301030002] ; Shenzhen Basic Research Project[WDZC20200824091903001] ; Shenzhen Basic Research Project[JSGG20220831105402004] ; Jiangsu Department of Technology Natural Science Fund[BK20220276] ; Dushu Lake Leading Talent Project[MSRIPIF8001006]
WOS研究方向	Engineering
WOS类目	Engineering, Environmental ; Engineering, Chemical
WOS记录号	WOS:001291631300001
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/189126
专题	中国科学院金属研究所
通讯作者	Liu, Minsu; Cheng, Hui-Ming; Qiu, Ling
作者单位	1.Tsinghua Univ, Inst Mat Res, Shenzhen Geim Graphene Ctr, Tsinghua Shenzhen Int Grad Sch, Shenzhen 518055, Guangdong, Peoples R China 2.Monash Univ, Monash Suzhou Res Inst MSRI, Suzhou 215000, Peoples R China 3.Monash Univ, Dept Mat Sci & Engn, Dept Chem & Biol Engn, Melbourne, Vic 3800, Australia 4.Chinese Acad Sci, Inst Proc Engn, Beijing 100190, Peoples R China 5.Chinese Acad Sci, Fac Mat Sci & Energy Engn, Shenzhen Inst Adv Technol, Inst Technol Carbon Neutral, Shenzhen 518055, Peoples R China 6.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Key Lab Energy Mat Carbon Neutral, 1068 Xueyuan Rd, Shenzhen, Peoples R China 7.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Ding, Siyuan,Zhan, Ke,Du, Yu,et al. Flash soldering of boron nitride nanosheets for all-ceramic films[J]. CHEMICAL ENGINEERING JOURNAL,2024,491:11.
APA	Ding, Siyuan.,Zhan, Ke.,Du, Yu.,Zhen, Fangzheng.,Zhu, Jiuyi.,...&Qiu, Ling.(2024).Flash soldering of boron nitride nanosheets for all-ceramic films.CHEMICAL ENGINEERING JOURNAL,491,11.
MLA	Ding, Siyuan,et al."Flash soldering of boron nitride nanosheets for all-ceramic films".CHEMICAL ENGINEERING JOURNAL 491(2024):11.