Study on interfacial healing mechanism of a Ni-Co base dual-phase superalloy during hot-compression bonding

doi:10.1016/j.matdes.2024.112923

IMR OpenIR

	Study on interfacial healing mechanism of a Ni-Co base dual-phase superalloy during hot-compression bonding
	Ren, Shaofei 1,2,3; Bai, Xiaolong 4; Liu, Sheng 5; Sun, Mingyue 1,3; Xu, Bin 1,3; Cui, Chuanyong 6; Ma, Guangcai 3
通讯作者	Sun, Mingyue(mysun@imr.ac.cn)
	2024-05-01
发表期刊	MATERIALS & DESIGN
ISSN	0264-1275
卷号	241 页码:13
摘要	Hot -compression bonding (HCB) as an advanced technique for preparation of large -size homogenized components is widely applied. Despite the fact that interfacial healing mechanisms during HCB have been extensively investigated, the interfacial healing mechanisms in duplex superalloys still need to be clarified. This article investigates effect of deformation temperature on multiple interface ( gamma ' - gamma ' , gamma-gamma, gamma-gamma ' ) healing mechanism of dualphase superalloys. The healing mechanism of gamma-gamma interface at different temperatures involves a necklace -like distribution of discontinuous dynamic recrystallization (DDRX) grains occupying original interface. With increasing deformation temperature, the healing mechanism of gamma ' - gamma ' interface transforms from DDRX to diffusion bonding due to weakening of strain concentration. Simultaneously, as deformation temperature increases, the deformation mechanism of primary gamma ' phase transforms from shearing by stacking fault to dislocation pairs. At deformation temperature 1100 degrees C, the healing mechanism of gamma ' - gamma interface is heterogeneous epitaxial recrystallization (HERX) induced by primary gamma ' phase driven by diffusion of Cr element in dislocation pairs. However, as deformation temperature decreases, healing mechanism in gamma ' - gamma interface transforms into DDRX. Although interfacial healing mechanism is transformed at different deformation temperatures, the synergistic action of different recrystallization mechanisms ensures that mechanical properties of joints reached the same level as those of base material.
关键词	Hot -compression bonding Bonding interface Discontinuous dynamic recrystallization Heterogeneous epitaxial recrystallization
资助者	National Key Research and Development Program ; National Natural Science Foundation of China ; IMR Innovation Foundation ; LingChuang Research Project of China National Nuclear Corporation ; CNNC Science Fund for Talented Young Scholars and Youth Innovation Promotion Association, CAS
DOI	10.1016/j.matdes.2024.112923
收录类别	SCI
语种	英语
资助项目	National Key Research and Development Program[2022YFB3705503] ; National Key Research and Development Program[2018YFA0702900] ; National Natural Science Foundation of China[52173305] ; National Natural Science Foundation of China[52101061] ; National Natural Science Foundation of China[52233017] ; National Natural Science Foundation of China[52203384] ; IMR Innovation Foundation[2022-PY12] ; LingChuang Research Project of China National Nuclear Corporation ; CNNC Science Fund for Talented Young Scholars and Youth Innovation Promotion Association, CAS
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:001236049300001
出版者	ELSEVIER SCI LTD
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/186651
专题	中国科学院金属研究所
通讯作者	Sun, Mingyue
作者单位	1.Chinese Acad Sci, Key Lab Nucl Mat & Safety Assessment, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 4.China United Gas Turbine Technol Co Ltd, Beijing 100016, Peoples R China 5.Suzhou Lab, Suzhou 215123, Peoples R China 6.Chinese Acad Sci, Shi Changxu Innovat Ctr Adv Mat, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Ren, Shaofei,Bai, Xiaolong,Liu, Sheng,et al. Study on interfacial healing mechanism of a Ni-Co base dual-phase superalloy during hot-compression bonding[J]. MATERIALS & DESIGN,2024,241:13.
APA	Ren, Shaofei.,Bai, Xiaolong.,Liu, Sheng.,Sun, Mingyue.,Xu, Bin.,...&Ma, Guangcai.(2024).Study on interfacial healing mechanism of a Ni-Co base dual-phase superalloy during hot-compression bonding.MATERIALS & DESIGN,241,13.
MLA	Ren, Shaofei,et al."Study on interfacial healing mechanism of a Ni-Co base dual-phase superalloy during hot-compression bonding".MATERIALS & DESIGN 241(2024):13.