Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W

doi:10.1109/TCPMT.2024.3467120

IMR OpenIR

	Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W
	Ying-Han 1; Dongrui-Liu 1; Shujun-Li 2
通讯作者	Shujun-Li(shjli@imr.ac.cn)
	2024-11-01
发表期刊	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN	2156-3950
卷号	14 期号:11 页码:1995-2002
摘要	The bouncing of the contactor upon closing can cause adhesion of contacts and wear of the contact tips, and these factors directly influence the reliability and electrical longevity of the contactor. In this study, a 3-D interpenetrating Cu-W contact with rhombic dodecahedron (RD) skeleton was fabricated using 3-D printing and infiltration technology; some commercial Cu-W contacts were prepared as comparison. Based on Hertz contact theory and extended theory, combined with the Kelvin-Voigt spring damping model, the principle of energy dissipation in contactor contact collision was analyzed. The Young modulus and damping coefficient of the two types of Cu-W contacts were obtained through stress-strain experiments and damping experiments using an INSTRON 5582 testing machine and a DpV55 shaker. The contact bounce characteristics of the two contact tips under different contactor parameters were obtained using a contact bounce test device and finally validated in practical contactors. The results show that the RD-structured Cu-W contact tip with a higher damping coefficient has more internal friction and better energy absorption when subjected to collision impacts, effectively suppressing contact bounce and exhibiting superior anti-bounce performance, especially at high-speed closings.
关键词	Contacts Contactors Damping Skeleton Vibrations Springs Electromagnetics Contact bounce contactors Cu-W composite damping interpenetrating 3-D structure
DOI	10.1109/TCPMT.2024.3467120
收录类别	SCI
语种	英语
WOS研究方向	Engineering ; Materials Science
WOS类目	Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS记录号	WOS:001371937300002
出版者	IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/181348
专题	中国科学院金属研究所
通讯作者	Shujun-Li
作者单位	1.Shenyang Univ Technol, Key Lab Special Elect Machine & High Voltage Appar, Minist Educ, Shenyang 110870, Liaoning, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110870, Liaoning, Peoples R China
推荐引用方式 GB/T 7714	Ying-Han,Dongrui-Liu,Shujun-Li. Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2024,14(11):1995-2002.
APA	Ying-Han,Dongrui-Liu,&Shujun-Li.(2024).Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,14(11),1995-2002.
MLA	Ying-Han,et al."Research on the Bounce Suppression of the 3-D Interpenetrating Cu-W".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 14.11(2024):1995-2002.