Nanoscale Mechanism of Microstructure-Dependent Thermal Diffusivity in Thick Graphene Sheets

doi:10.3866/PKU.WHXB202404024

IMR OpenIR

	Nanoscale Mechanism of Microstructure-Dependent Thermal Diffusivity in Thick Graphene Sheets
	Bai, Tianqi 1,2; Huang, Kun 3,4; Liu, Fachen 1,2; Shi, Ruochen 1; Ren, Wencai 3,4; Pei, Songfeng 3,4; Gao, Peng 1,2,5,6,7,8,9; Liu, Zhongfan 6,10
通讯作者	Pei, Songfeng(pgao@pku.edu.cn) ; Gao, Peng(sfpei@imr.ac.cn) ; Liu, Zhongfan(zfliu@pku.edu.cn)
	2025-03-01
发表期刊	ACTA PHYSICO-CHIMICA SINICA
ISSN	1000-6818
卷号	41 期号:3 页码:9
摘要	The rapid advancement in the integration density of electronic components has led to a pressing need for effective thermal management solutions. Among the promising materials in this regard, graphene stands out due to its exceptional thermal conductivity properties. Currently, the production of ultra-high thermally conductive thick graphene sheets primarily involves the reduction of graphene oxide. However, despite significant progress, the impact of defects on thermal properties remains inadequately understood, limiting the achievement of thermal conductivity exceeding 1500 W center dot m(-1)center dot K-1. During the preparation process of reduced graphene oxide-based graphene sheets, hole structures are inevitably formed, reducing the overall density and thus decreasing thermal conductivity. However, the influencing factors on thermal diffusivity, one of the determining factors of thermal conductivity, have not been reported. Thus, we defined the intrinsic thermal diffusivity specific to materials with internal holes and further investigated the correlation between the intrinsic thermal diffusivity of thick graphene sheets and microstructure through various electron microscopy characterization, thermal diffusivity measurements, and simulations. We aim to elucidate the factors and mechanisms affecting the thermal diffusivity and hence thermal conductivity. Our research reveals subtle insights, particularly regarding the impact of holes of different sizes and quantities on thermal diffusivity. Notably, our simulation results show that a real dense-small-holes structure in graphene sheets can reduce thermal diffusivity by 39.4%, more than twice the reduction caused by a single-large-hole structure (16.1%). Statistical conclusions obtained through three-dimensional reconstruction also perfectly match these computational results. We emphasize that the presence of dense-small-holes structures disrupt the original high-speed heat transfer paths more severely, while the effect of single-large-hole structures are relatively weaker, primarily reducing overall density and thus thermal conductivity. Additionally, we found that the out-of-plane crystallinity has a significant impact on thermal diffusivity, further enhancing our understanding of microstructural factors affecting thermal diffusivity. By elucidating these mechanisms, our findings make significant contributions to the technological advancement of producing ultra-high thermally conductive thick graphene sheets. A deeper understanding of the interaction between microstructure and thermal performance brings hope for the development of next-generation electronic device thermal management solutions. Through continued research in this field, we anticipate further improvements in the performance and efficiency of graphene thermal management systems, ultimately driving innovation in electronic device design and manufacturing.
关键词	Thick graphene sheets Intrinsic thermal diffusivity Single large hole Dense small holes Out-of-plane crystallinity
资助者	National Natural Science Foundation of China
DOI	10.3866/PKU.WHXB202404024
收录类别	SCI
语种	英语
资助项目	National Natural Science Foundation of China[T2188101] ; National Natural Science Foundation of China[52125307] ; National Natural Science Foundation of China[52021006] ; National Natural Science Foundation of China[52273240]
WOS研究方向	Chemistry
WOS类目	Chemistry, Physical
WOS记录号	WOS:001397976800002
出版者	PEKING UNIV PRESS
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/180164
专题	中国科学院金属研究所
通讯作者	Pei, Songfeng; Gao, Peng; Liu, Zhongfan
作者单位	1.Peking Univ, Sch Phys, Electron Microscopy Lab, Beijing 100871, Peoples R China 2.Peking Univ, Acad Adv Interdisciplinary Studies, Beijing 100871, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 4.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 5.Peking Univ, Int Ctr Quantum Mat, Beijing 100871, Peoples R China 6.Beijing Graphene Inst, Beijing 100095, Peoples R China 7.Collaborat Innovat Ctr Quantum Matter, Beijing 100871, Peoples R China 8.Peking Univ, Interdisciplinary Inst Light Element Quantum Mat, Beijing 100871, Peoples R China 9.Peking Univ, Res Ctr Light Element Adv Mat, Beijing 100871, Peoples R China 10.Peking Univ, Coll Chem & Mol Engn, Natl Lab Mol Sci, Beijing 100871, Peoples R China
推荐引用方式 GB/T 7714	Bai, Tianqi,Huang, Kun,Liu, Fachen,et al. Nanoscale Mechanism of Microstructure-Dependent Thermal Diffusivity in Thick Graphene Sheets[J]. ACTA PHYSICO-CHIMICA SINICA,2025,41(3):9.
APA	Bai, Tianqi.,Huang, Kun.,Liu, Fachen.,Shi, Ruochen.,Ren, Wencai.,...&Liu, Zhongfan.(2025).Nanoscale Mechanism of Microstructure-Dependent Thermal Diffusivity in Thick Graphene Sheets.ACTA PHYSICO-CHIMICA SINICA,41(3),9.
MLA	Bai, Tianqi,et al."Nanoscale Mechanism of Microstructure-Dependent Thermal Diffusivity in Thick Graphene Sheets".ACTA PHYSICO-CHIMICA SINICA 41.3(2025):9.