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掺杂二氧化钛瓷的烧结与电性能
罗明
学位类型硕士
导师曲哲
1992
学位授予单位中国科学院金属研究所
学位授予地点中国科学院金属研究所
摘要本文采用常规工艺制备了掺杂二氧化钛半导体。分别研究了成形压力,Nb_2O_5,SiO_2杂质对二氧化钛的烧结以及杂质,微观结构对其电性能的影响。研究表明,1mole V_oNb_2O_5样品,1350 ℃时,或者1500 ℃时,成形压力只有分别大于1100 kg/cm~2或800 kg/cm~2,才能获得较高的致密度。加入0.8 mole% Nb_2N_5后,晶粒长大缓慢,但1500 ℃烧结时该浓度的掺杂促进了烧结。掺铌二氧化钛的晶粒长大遵循(D-bar)_t~2-(D-bar)_o~2 = kt。较高浓度掺杂情况下,阳离子扩散为烧结的控制步骤。SiO_2的加入使体系中出现液相,从而促进了烧结,其晶粒长大符合(D-bar)~3 ∝ kt。二氧化钛半导体的电阻率随Nb_2O_5浓度的增加而减小,当浓度为0.8 ~ 1.0mole%时,电阻率最低。当浓度继续增加时,样品电阻率因晶界出现高阻相而迅速增加。电导率随温度里指数形式增加。当温度高于300 ℃后,低掺杂(≤1.0mole%)样品的电导激活能略构减小。内含氧气分子的带电气孔的散射是造成这种现象的原因。
其他摘要Semiconductive TiO_2 (rutile) ceramics were obtained in a conventional way. The effects of Nb_2O_5, SiO_2 doping contaminants on TiO_2 sintering and the electrical properties were investigated. It was found that Nb_2O_5 particles resist grain growth at 1350 ℃ when the form pressure of green pellet is less than 1100Kg/cm~2, and higher density is obtained when the pressure is higher than 1100Kg/cm~2 at 1350 ℃ or 800Kg/cm~2 at 1500 ℃. Grain growth was extremely retarded at 0.8 mole% Nb_2O_5 at 1400 ℃, whereas the densification was inhenced at 1500 ℃. The grain growth of Nb-doping TiO_2 follows (D-bar)_t~2-(D-bar)_o~2 = kt. At higher doping concentration, cation ions are rate controlling. After the third element SiO_2 was added, liquid sintering happened. In this case, the grain growth follows (D-bar)~3 ∝ kt. The resistivity decreases with increasing Nb-doping, but after the concentration is higher than 0.8 ~ 1.0mole%, it increases rapidly, which is maybe caused by second phases with low conductivity. The conductivity increases exponentially with increasing temperature. The activation energy of low doping specimen (≤1mole%) decreases slightly at temperature over 300℃, which is attributed to the scattering of pores containing O_2.
页数90
语种中文
文献类型学位论文
条目标识符http://ir.imr.ac.cn/handle/321006/17545
专题中国科学院金属研究所
推荐引用方式
GB/T 7714
罗明. 掺杂二氧化钛瓷的烧结与电性能[D]. 中国科学院金属研究所. 中国科学院金属研究所,1992.
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