Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces

doi:10.1016/j.surfin.2022.101838

IMR OpenIR

	Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces
	Gao, Zhaoqing 1,2,3; Wang, Chen 1; Gao, Nan 1; Guo, Shihao 1; Chen, Yinbo 2,3; Chai, Zhenbang 1,4; Wang, Yunpeng 1; Ma, Haitao 1
通讯作者	Wang, Yunpeng(yunpengw@dlut.edu.cn) ; Ma, Haitao(htma@dlut.edu.cn)
	2022-06-01
发表期刊	SURFACES AND INTERFACES
ISSN	2468-0230
卷号	30 页码:12
摘要	In this study, the long-term (up to 400 days) room temperature aging tests for Ga-21.5In-10Sn/Cu interface were investigated, confirming the formation of intermetallic compounds at room temperature could cause the serious interfacial instability issues. One novel strategy using solid solution alloys with high thermal stability and high diffusion activation energy to design the barrier layer materials to inhibit the diffusion of solid atoms or interfacial reactions was proposed. The feasibility of Ni-W and Ni-W-graphene coatings as the interfacial reaction barrier of Ga-21.5In-10Sn/Cu liquid-solid interfaces was explored, indicating a novel application of Ni-W electroplated coatings in electronic/electrical contacts fields besides these traditional applications in wear-resistance, corrosion-resistance and heat corrosion resistance fields. The challenging agglomeration issues of graphene in water soluble solutions was successfully solved using the ethylene glycol as the effective dispersant. The temperature dependence of Ni-W and Ni-W-graphene coatings as the interfacial reaction barrier was compared. It was preliminarily contended that the addition of graphene particles was detrimental to improve the reaction barrier properties of Ni-W matrix. This finding provides a novel strategy to solve the interfacial instability problem of Ga-21.5In-10Sn/Cu interfaces and will enable wider applications of electroplated Ni-W coatings, promoting the development of soft and stretchable Ga-based alloys/Cu conductors in wearable electronics.
关键词	Ni-W-graphene coatings Interfacial reaction barrier CuGa 2 layer Ga-21 5In-10Sn liquid alloys Ni -W solid solution
资助者	Nation Natural Science Foundation of China
DOI	10.1016/j.surfin.2022.101838
收录类别	SCI
语种	英语
资助项目	Nation Natural Science Foundation of China[51871040]
WOS研究方向	Chemistry ; Materials Science ; Physics
WOS类目	Chemistry, Physical ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000782283600002
出版者	ELSEVIER
引用统计	被引频次：10[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/172834
专题	中国科学院金属研究所
通讯作者	Wang, Yunpeng; Ma, Haitao
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 3.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 4.Tokyo Inst Technol, Dept Mat Sci & Engn, Tokyo 1528552, Japan
推荐引用方式 GB/T 7714	Gao, Zhaoqing,Wang, Chen,Gao, Nan,et al. Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces[J]. SURFACES AND INTERFACES,2022,30:12.
APA	Gao, Zhaoqing.,Wang, Chen.,Gao, Nan.,Guo, Shihao.,Chen, Yinbo.,...&Ma, Haitao.(2022).Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces.SURFACES AND INTERFACES,30,12.
MLA	Gao, Zhaoqing,et al."Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces".SURFACES AND INTERFACES 30(2022):12.