Properties and Microstructures of Sn-Bi-X Lead-Free Solders

doi:10.1155/2016/9265195

IMR OpenIR

	Properties and Microstructures of Sn-Bi-X Lead-Free Solders
	Yang, Fan 1; Zhang, Liang 1,2; Liu, Zhi-quan 2; Zhong, Su-juan 3; Ma, Jia 3; Bao, Li 3
通讯作者	Zhang, Liang(zhangliang@jsnu.edu.cn)
	2016
发表期刊	ADVANCES IN MATERIALS SCIENCE AND ENGINEERING
ISSN	1687-8434
页码	15
摘要	The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139 degrees C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.
资助者	Research Innovation Project for College Graduate of Jiangsu Province ; Natural Science Foundation of China ; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering) ; Six Kind Skilled Personnel Project of Jiangsu Province ; Qing Lan Project ; High Level Talent Plan of Jiangsu Normal University ; Jiangsu Normal University
DOI	10.1155/2016/9265195
收录类别	SCI
语种	英语
资助项目	Research Innovation Project for College Graduate of Jiangsu Province[KYZZ16_0469] ; Natural Science Foundation of China[51475220] ; State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering)[SKLABFMT-2015-03] ; Six Kind Skilled Personnel Project of Jiangsu Province[XCL-022] ; Qing Lan Project ; High Level Talent Plan of Jiangsu Normal University[YQ2015002] ; Jiangsu Normal University
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:000392086400001
出版者	HINDAWI PUBLISHING CORP
引用统计	被引频次：42[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/123661
专题	中国科学院金属研究所
通讯作者	Zhang, Liang
作者单位	1.Jiangsu Normal Univ, Sch Mech & Elect Engn, Xuzhou 221116, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 3.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou 450001, Peoples R China
推荐引用方式 GB/T 7714	Yang, Fan,Zhang, Liang,Liu, Zhi-quan,et al. Properties and Microstructures of Sn-Bi-X Lead-Free Solders[J]. ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,2016:15.
APA	Yang, Fan,Zhang, Liang,Liu, Zhi-quan,Zhong, Su-juan,Ma, Jia,&Bao, Li.(2016).Properties and Microstructures of Sn-Bi-X Lead-Free Solders.ADVANCES IN MATERIALS SCIENCE AND ENGINEERING,15.
MLA	Yang, Fan,et al."Properties and Microstructures of Sn-Bi-X Lead-Free Solders".ADVANCES IN MATERIALS SCIENCE AND ENGINEERING (2016):15.